Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences.
A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below.
The scope of the journal includes:
1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes).
2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis.
3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification.
4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.
The aim of the short communications is to enable researchers to rapidly share their most exciting work with their colleagues. The expected time from submission to final decision is approximately 6.4 weeks.
Benefits to authors
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Editorial board
Editor-in-Chief
- L.G. Hultman
Linköping University, Linköping, Sweden
Editor
- P. Eklund
Linköping University, Linköping, Sweden
Special Issue Editor
- J.S. Colligon
STFC Daresbury Laboratory, Warrington, Cheshire, United Kingdom
Associate Editors
- O.B. Malyshev
STFC Daresbury Laboratory, Warrington, Cheshire, United Kingdom - P. Mayrhofer
TU Wien, Wien, Austria - L. Sabbatini
Università degli Studi di Bari Aldo Moro, Bari, Italy
Editorial Board Member
- G. Abadias
Université de Poitiers, Chasseneuil-Futuroscope, France - M. Anderle
Autonomous Province of Trento, Trento, Italy - K. Baba
Industrial Technology Center of Nagasaki, Nagasaki, Japan - S. Baba
Seiki University, Tokyo, Japan - S. Baragetti
University of Bergamo, Dalmine BG, Italy - L. Bardos
Uppsala University, Uppsala, Sweden - M. Bartosik
TU Wien, Wien, Austria - F. Berto
Norwegian University of Science & Technology NTNU, Trondheim, Norway - H. Biederman
Charles University, Praha 2, Czech Republic - W. Dai
Pennsylvania State University, University Park, Pennsylvania, USA - J.L. de Segovia
Instituto de Ciencia de Materiales de Madrid, Cantoblanco, Madrid, Spain - Y. Du
Central South University, Changsha, Hunan, China - R.G. Elliman
Australian National University, Canberra, Australian Capital Territory, Australia - A. Erdemir
Argonne National Laboratory, Argonne, Illinois, USA - A. Goodyear
The Open University, Milton Keynes, UK - J.H. Huang
National Tsing Hua University, Hsinchu, Taiwan - R.E. Hurley
Queen's University Belfast, Belfast, Northern Ireland, UK - A. Ignatiev
University of Houston, Houston, Texas, USA - K. Jousten
Physikalisch-Technische Bundesanstalt, Berlin, Germany - D.S. Karpuzov
University of Alberta, Edmonton, Alberta, Canada - R. Kersevan
CERN, Geneva 23, Switzerland - S. Kodambaka
University of California at Los Angeles (UCLA), Los Angeles, California, USA - M.K. Lei
Dalian University of Technology, Dalian, China - K. Ludwig
Boston University, Boston, Massachusetts, USA - R. Miles
Northumbria University, Newcastle Upon Tyne, UK - Y.K. Mishra
University of Kiel, Kiel, Germany - A.Z. Moshfegh
Sharif University of Technology, Tehran, Iran - D. Music
RWTH Aachen University (RWTH), Aachen, Germany - J. Musil
University of West Bohemia, Plzen, Czech Republic - V. Nagirnyi
University of Tartu, Tartu, Estonia - H. Pedersen
Linköping University, Linköping, Sweden - I. Petrov
University of Illinois at Urbana-Champaign, Urbana, Illinois, USA - H. Pouraliakbar
WorldTech Scientific Research Center (WT-SRC), Tehran, Iran - A. Prakash
Intersil, A Renesas Company, Tempe, Arizona, USA - C. Rego
Manchester Metropolitan University, Manchester, UK - A. Rossi
Università di Cagliari, Cagliari, Italy - Y. Saito
KEK Japan, Tsukuba, Japan - J. Šetina
Institute of Metals and Technology, Ljubljana, Slovenia - F. Sharipov
Universidade Federal do Paraná (UFPR), Curitiba, Brazil - L. Siller
Newcastle University, Newcastle Upon Tyne, UK - C.Q. Sun
Nanyang Technological University, Singapore, Singapore - Y. Tanimoto
KEK Japan, Tsukuba, Japan - D. Valougeorgis
University of Thessaly, Volos, Greece - H. Wang
Texas A&M University, College Station, Texas, USA - M.S. Wong
National Dong Hwa University, Hualien, Taiwan - V.E. Yurasova
M.V. Lomonosov Moscow State University, Moscow, Russian Federation - W. Zheng
Jilin University, Changchun City, China