Thermal Science and Engineering Progress (TSEP) publishes original, high-quality research articles that span activities ranging from fundamental scientific research and discussion of the more controversial thermodynamic theories, to developments in thermal engineering that are in many instances examples of the way scientists and engineers are addressing the challenges facing a growing population – smart cities and global warming – maximising thermodynamic efficiencies and minimising all heat losses. It is intended that these will be of current relevance and interest to industry, academia and other practitioners.

It is evident that many specialised journals in thermal and, to some extent, in fluid disciplines tend to focus on topics that can be classified as fundamental in nature, or are ‘applied’ and near-market. Thermal Science and Engineering Progress will bridge the gap between these two areas, allowing authors to make an easy choice, should they or a journal editor feel that their papers are ‘out of scope’ when considering other journals.

The range of topics covered by Thermal Science and Engineering Progress addresses the rapid rate of development being made in thermal transfer processes as they affect traditional fields, and important growth in the topical research areas of aerospace, thermal biological and medical systems, electronics and nano-technologies, renewable energy systems, food production (including agriculture), and the need to minimise man-made thermal impacts on climate change.

Review articles on appropriate topics for TSEP are encouraged, although until TSEP is fully established, these will be limited in number. Before submitting such articles, please contact one of the Editors, or a member of the Editorial Advisory Board with an outline of your proposal and your expertise in the area of your review.

Editorial board


  • D. A. Reay
    David Reay & Associates, Whitley Bay, UK

Executive Editor

  • B. Sturm
    Universität Kassel, Witzenhausen, Germany

Associate Editor

  • H. Jouhara
    Brunel University London, Uxbridge, UK
  • A. Nasirahmadi
    Universität Kassel, Witzenhausen, Germany

Editorial Board

  • A. Akisawa
    Tokyo University of Agriculture and Technology, Tokyo, Japan
  • A. Baïri
    University of Paris, Ville d'Avray, France
  • P. K. Bansal
    Satya International Ltd, Greenwood, Mississippi, USA
  • M. Bantle
    SINTEF Energy Research, Trondheim, Norway
  • N. Bennett
    Heriot-Watt University, Edinburgh, Scotland, UK
  • V. Bianco
    Università degli Studi di Genova, Genova, Italy
  • X. Chen
    The University of Nottingham, Nottingham, England, UK
  • X.D. Chen
    Soochow University, Suzhou, Jiangsu Province, China
  • U. Desideri
    Università di Pisa, Pisa, Italy
  • I. Dincer
    University of Ontario Institute of Technology, Ontario, Canada
  • K. Hooman PhD
    University of Queensland, Brisbane, Queensland, Australia
  • T. Karayiannis
    Brunel University London, Middlesex, England, UK
  • J.J. Klemeš
    Brno University of Technology (VUT Brno), Brno, Czech Republic
  • R. Law
    Newcastle University, Newcastle Upon Tyne, UK
  • O. Manca
    Seconda Università degli Studi di Napoli, Aversa, Italy
  • Y. F. Maydanik
    Institute of Thermal Physics, Ekaterinburg, Russian Federation
  • A. S. Mujumdar
    McGill University, Québec, Quebec, Canada
  • S. Srinivasa Murthy
    Indian Institute of Science, Bangalore, India
  • A. Mustaffar
    Newcastle University, Newcastle upon Tyne, UK
  • H.F. Oztop
    Firat University, Elazig, Turkey
  • B. Palm
    KTH Royal Institute of Technology, Stockholm, Sweden
  • M. Pate
    Texas A & M University, College Station, Texas, USA
  • P.A. Pilavachi
    University of Western Macedonia, Kozani, Greece
  • B.B. Saha
    Kyushu University, Fukuoka, Japan
  • H. Wang
    Queen Mary, University of London (QMUL), London, England, UK
  • J. Xu
    North China Electric Power University, Beijing, China
  • Y. Yan
    The University of Nottingham, Nottingham, England, UK
  • C. Y. Zhao
    Shanghai Jiao Tong University, Shanghai, China