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Armstrong launches Envelope platform for optimizing mechanical systems

Armstrong Fluid Technology has introduced a new integrated digital platform called Envelope that connects components in a mechanical system and delivers significant cost and energy savings.

Envelope unites Armstrong and partner solutions, delivering optimization through performance mapping, cutting-edge analytics and lifecycle services.

A core element of the Envelope platform is the ability to create detailed performance ‘profiles’ of components in a system, and to leverage that knowledge for optimal sizing and modulation of output.

“The true power of the Envelope Platform is in how it enables system optimization through performance coupling with partner products or solutions,” said Pratik Sharma, Global Director, Building Services & Performance Management at Armstrong Fluid Technology. “Working within this platform, Armstrong, and digitally controlled solutions of all types, can connect and coordinate operations for improved performance and efficiency. Components that can be connected to the Envelope platform include chillers, cooling towers, boilers and heat pumps, made by a wide range of well-known industry manufacturers.”