Expanding on the company's Design Envelope (DE) technology, these new pumps are designed to further increase building owners’ energy savings while providing more sustainable solutions.
“The Design Envelope technology integrates the latest selection, control and hydronic tools into heat-transfer solutions that naturally accommodate changes in building design and demand to ensure that system performance is at an optimum at any given time,” according to Lex van der Weerd, CEO of Armstrong Fluid Technology.
”It is a more intelligent method of ensuring better HVAC equipment efficiency and achieving the lowest lifecycle cost.”
The new Generation 3 DE pumps also feature:
- TEFC Motors as standard to 25HP;
- 230/460/575V options;
- fixed configuration codes for ease of product identification and order entry;
- 'flat map' selection;
- 2-10 day express shipment;
- exceeds ASHRAE 90.1 energy standard for buildings.
Armstrong’s Design Envelope technology delivers optimized lifetime building performance by modeling equipment and system behavior, monitoring authentic system conditions, and dynamically adjusting equipment operation to match system demand. This is achieved through Armstrong pumping systems, booster systems, an Intelligent Fluid Management System (iFMS), an Integrated Plant Controller (IPC), a Chilled Water Integrated Plant Package (IPP), and Compass circulators.